MediaTek will be releasing two new chips for mid-ranged phones using TSMC’s 12nm process. What’s great about the smaller process is that it offers more efficient power. In other words, better battery life.
After a bad year where their flagship SoC Helio X30 underperformed by being chosen to power only the Meizu Pro-7 Plus and the Meitu V6, the company scrapped their plans to develop the Helio X line.
They have instead chosen to focus on mid-range segment devices where they are looking to expand their presence by developing a couple of chipsets named Helio P40 and P70. They are expected to arrive in the second quarter of 2018 with features that can satisfy both the high-end segment of the market as well as enhance their mid-range share.
As for the features of the new chips, a few details have been leaked about both. This is what is known so far:
The Helio P40:
- Will have an octa-core chip to process data
- Will feature 4x A73 cores clocked at 2.0GHz and 4x A53 cores clocked at the same speed.
- The GPU will be a Mail-G72 MP3 clocked at 700Mhz
- The GPU will have at least 3 ISP’s with support for 32MP cameras.
- The chip will also support up to 8GB LPDDR4X of Ram at 1866Mhz and eMMC 5.1
- It will have UFS 2.1 storage.
- It will support TensorFlow and Cat.7 LTE.
There are fewer details about the Helio P70 but it’s supposed to be a more powerful iteration of his brother-in-development, here is what is known so far:
- It’s supposed to rival the Snapdragon 660 with a build of four 2.5GHz A73 cores and four 2.0GHz A53 cores.
- The main difference being on the GPU where the chip will deliver more powerful and detailed graphics thanks to the presence of quad-core Mali-G72 GPU clocked at 800MHz.
The specs seem to be powerful enough to be attracting a new body of investors to the company. Reports indicate that Xiaomi will carry the chips in 2018 as well as small brands of smartphones such as Vivo, Oppo and Gionee.
Leave a Reply