Leaked Prototype Premium JiaYu S1 News!

It seems that Jiayu may be entering the premium market to compete with the likes of Oppo, Meizu, Huawei, ZTE, etc.

Check this one out, 5″ Full HD 1080p with 441ppi IPS OGS screen, a Quad-core Krait Harvard Superscalar Qualcomm Snapdragon S4 APQ 8064 clocked at 1.5Ghz with 2GB of RAM! 32GB of ROM, a GPU Adreno 320 and 13MP camera.

Yikes! It really looks like Jiayu is set to raise their standards. We know that Jiayu is one of the best budget smartphone manufactures around. This leaked info has shown how Jiayu may be serious about trying to draw the attention of smartphone users all over the world. Like the Lenovo K900, by using Qualcomm S4 Krait SoC, it means the device will support one SIM card only. Tough news for those dual SIM fans who would love a new competitor for Samsung Galaxy Note II Duos!

We‘ll see what more intriguing moves by Jiayu over these few months ahead.

Ari

Comments

3 responses to “Leaked Prototype Premium JiaYu S1 News!”

  1. Damian Parsons Avatar
    Damian Parsons

    Looks sweet Ari! As you mentioned, the lack of dual-sim could be a real downer for some. The super-fast CPU and huge storage and RAM should pull some power users. Now let’s see if JiaYu can get on the ball about adding 850 and 1900 WCDMA

  2. ari Avatar
    ari

    Well, I think sooner or later high performance SoC supporting dual sim will arrive. It‘s just around the corner you‘ll see. This year I‘ve got the feeling that Mediatek would soon found themselves a formidable opponent. Not just from the big names I guess. It also come from unpopular brand of SoC manufacturer. Let‘s hope this year will be the year of variety SoC brand. High performance yet affordable for all.

    1. Damian Parsons Avatar
      Damian Parsons

      Your prediction is already partially true, the MSM8225 dual-core is out with dual-SIM in $200 phones. I have it in my current phone and it scores quite nice on Antutu compared to MTK6577. Especially in 2D marks

Leave a Reply

Your email address will not be published. Required fields are marked *